
PCB Automation / CHENGTAI
Automatic TWO-PIN Insertion Machine
Integrate board stacking, taping and pin insertion in the PCB drilling preparation process.
Discuss configuration, installation and project-specific specifications with our engineers.
THE EQUIPMENT AT A GLANCE
Designed for the task.
- Copper panel and aluminium sheet loading
- Board stacking, gluing and laser marking
- Automatic magazine loading
PROCESS FIT
Where it works.
Drilling preparation for PCB and IC-substrate production.
Share your process inputs, production constraints and integration requirements. We will review the appropriate equipment configuration before quotation.
TECHNICAL OVERVIEW
Specifications & configuration.
- Process
- Board stacking, taping and TWO-PIN insertion
- Positioning
- CCD vision positioning
- Operating speed
- 3 stacks/min — confirm configuration and board conditions
- Material flow
- AGV integration available
- Applications
- PCB, IC substrates, HDI and multilayer server boards
- Daily output
- Over 3,000 boards, dependent on board configuration and operating schedule
- Installed sales milestone
- 150+ units
Final specifications and acceptance criteria are agreed for your selected configuration.
PROCESS SEQUENCE
One coordinated workflow.
- 01
Copper panel and aluminium sheet loading
- 02
CCD vision positioning for copper panels
- 03
PIN insertion and backing-board drilling
- 04
Board stacking, gluing and laser marking
- 05
Stacked-board unloading
Continue exploring.
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Combine tape cutting, pin removal and separated material unloading after drilling.

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Six-Axis Inclined-Rack Board Loader / Unloader ↗
Automatic board handling configured around your carrier, panel characteristics and production-line layout.
