Process assessment
Review panel characteristics, existing equipment, liquid chemistry and operating constraints.
SOLUTIONS & SERVICES
Connect the equipment. Improve the workflow.
From one handling station to an integrated production workflow, begin with your material, your process and your existing line.
FACTORY AUTOMATION
Build around your existing process.
Evaluate loading and unloading, carriers, AGV material flow and MES integration as a connected system.
Explore automation equipment →Discover the smart factory system →
APPLICATION CASES
Engineering in context.
mSAP / IC substrates
mSAP Process Automation ↗
ESD protection, enclosed conveying and edge gripping for ultra-thin panels in IC-substrate production.
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0.5–12 mm boards
Thick Server PCB Automation ↗
Composite gripping, assisted transfer and separated TRAY storage for thick server compute boards.
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0.05–2 mm panels
Thin Inner-Layer PCB Handling ↗
Vision positioning, flexible conveying and protected end-effectors for inner-layer panels down to 0.05 mm.
Explore the solution →APPLICATION ENGINEERING
Different panels. Different requirements.
PCB drilling workflows ↗
Integrate stacking, taping, pin insertion, magazine transfer and pin removal around existing drilling operations.
Thin & thick panel handling ↗
Review material stiffness, weight, surface sensitivity and carrier design before selecting a handling configuration.
Environmental process evaluation ↗
Review developer chemistry and circulating-water conditions to determine treatment and maintenance requirements.
FROM REQUIREMENT TO DELIVERY
A practical engineering process.
Custom equipment engineering
Develop a configuration around your production task, line layout and integration requirements.
Installation & lifecycle support
Plan commissioning, operator training, maintenance and spare-parts support with our team.
Project scope includes agreed equipment configuration, acceptance criteria, installation conditions and service arrangements. Contact the team to confirm on-site availability for your location.