APPLICATION CASE
Thin Inner-Layer PCB Handling
A gentler route through production.
The production challenge.
Very thin inner-layer panels need controlled support and positioning to reduce warping, jamming, edge chipping and contamination across changing production processes.
A customized factory automation approach for mixed-orientation inner-layer panels, multiple board types and oxide-treatment processes.
Discuss a similar project ↗ENGINEERING DETAIL / 01
Flexible conveying for thin panels
A dedicated belt-conveyor design supports thin panels as they move through the line, helping avoid warping, jamming and edge chipping.
ENGINEERING DETAIL / 02
Mixed-model production and vision positioning
Programs switch for different processes, with an optional separator-sheet stage. AI vision locates panels without traditional lift-and-press positioning, limiting pressure and scratches on panel surfaces.
ENGINEERING DETAIL / 03
Keep lubrication away from the product
Bellows covers seal lubricated transmission components. Wear-resistant PEEK in the moving suction-rod parts supports clean, stable end-effector operation.
ENGINEERING DETAIL / 04
Integrated end-effector tooling
The end-effector combines tailored support with an integrated vacuum generator, supporting low-energy, low-noise operation for the selected panel and production conditions.
