EQUIPMENT FAMILY
Inspection & Measurement
Non-destructive internal inspection and temperature-dependent deformation measurement for PCB and substrate production.

Inspection & Measurement
High-Speed 3D CT Inspection System ↗
Non-destructive tomographic imaging for internal PCB features, supported by defect assessment and inspection-data traceability.

Inspection & Measurement
Thermal Warpage Measurement System ↗
Measure temperature-dependent panel deformation with shadow moiré optical technology.
