PCB & SEMICONDUCTOR INTELLIGENT EQUIPMENT
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High-Speed 3D CT Inspection System

Inspection & Measurement / CHENGTAI

High-Speed 3D CT Inspection System

Non-destructive tomographic imaging for internal PCB features, supported by defect assessment and inspection-data traceability.

Discuss configuration, installation and project-specific specifications with our engineers.

THE EQUIPMENT AT A GLANCE

Designed for the task.

  • View internal structures without sectioning
  • AI-assisted defect assessment
  • Inspection data for process improvement

PROCESS FIT

Where it works.

Internal-feature inspection in PCB manufacturing. Request a sample evaluation for resolution, cycle time and defect-detection requirements.

Share your process inputs, production constraints and integration requirements. We will review the appropriate equipment configuration before quotation.

TECHNICAL OVERVIEW

Specifications & configuration.

Request a specification sheet →
Inspection method
3D computed tomography
Inspection targets
Hole-position deviation, hole-wall defects and inner-layer misalignment
Operation
Online inspection configuration
Data
Inspection records and drilling-process feedback

Final specifications and acceptance criteria are agreed for your selected configuration.

Continue exploring.

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LET'S ENGINEER YOUR NEXT STEP

Start with your requirements.
Build a better production line.

Discuss your project ↗