Inspection & Measurement / CHENGTAI

Thermal Warpage Measurement System

Measure temperature-dependent panel deformation with shadow moiré optical technology.

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Discuss configuration, installation and project-specific specifications with our engineers.

THE EQUIPMENT AT A GLANCE

Designed for the task.

Thermal deformation measurement
Offline process development and online inspection
Automated loading, unloading and OK/NG sorting on online configurations

PROCESS FIT

Where it works.

PCB and substrate thermal-deformation evaluation for process development and production inspection.

Share your process inputs, production constraints and integration requirements. We will review the appropriate equipment configuration before quotation.

TECHNICAL OVERVIEW

Specifications & configuration.

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Measurement method: Shadow moiré optical measurement
Height resolution: Up to 0.85 μm; resolution is not measurement accuracy
Test temperature: Up to 300°C; confirm sample and test conditions
Configurations: Offline benchtop / online automated inspection
Data integration: Warpage curves and MES data connection

Final specifications and acceptance criteria are agreed for your selected configuration.

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