APPLICATION CASES
Real process challenges. Specific engineering.
Explore three production scenarios: mSAP contamination control, heavy server boards and delicate inner-layer panels. See the mechanisms and integration choices behind each solution.
mSAP / IC substrates
mSAP Process Automation ↗
ESD protection, enclosed conveying and edge gripping for ultra-thin panels in IC-substrate production.
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0.5–12 mm boards
Thick Server PCB Automation ↗
Composite gripping, assisted transfer and separated TRAY storage for thick server compute boards.
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0.05–2 mm panels
Thin Inner-Layer PCB Handling ↗
Vision positioning, flexible conveying and protected end-effectors for inner-layer panels down to 0.05 mm.
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