APPLICATION CASE
mSAP Process Automation
Clean handling for fine-line manufacturing.
The production challenge.
Fine-line and space manufacturing needs controlled contamination, stable electrostatic protection and panel transfer that avoids contact with sensitive circuits.
A factory automation approach for mSAP processes serving IC substrates used in AI servers and high-speed optical modules.
Discuss a similar project ↗ENGINEERING DETAIL / 01
A controlled frame and enclosure
A top-mounted FFU supplies clean air around the equipment. Mirror-finish SUS304 stainless steel is used in the precision-exposure area; SUS201 sheet metal serves the pretreatment and etching areas. A sealed frame limits openings to AGV access and panel infeed/outfeed.
ENGINEERING DETAIL / 02
Low-particle conveying and ESD control
Non-contact magnetic-ring drive avoids drive friction. UPE antistatic rollers and ionising bars at the infeed and outfeed address static accumulation. Closed transfer modules and enclosed igus cable carriers protect the moving system.
ENGINEERING DETAIL / 03
Edge gripping and flexible actuation
The actuation mechanism grips panel edges to avoid contact with fine circuits. An overhead debris catcher protects the panel. Automatic width adjustment is available in MES and manual modes, with optional 90° or 180° rotation.
ENGINEERING DETAIL / 04
Protected AGV docking
A floating transfer platform receives the carrier without relative positioning friction. Carrier-presence, lowering-obstacle and orientation detection help prevent incorrect loading. Pneumatic clamping compensates for incoming-position variation with ±0.5 mm positioning.
Inside the application.
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