PCB & SEMICONDUCTOR INTELLIGENT EQUIPMENT
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APPLICATION CASE

Thick Server PCB Automation

Confident handling for heavy, complex panels.

Thick Server PCB Automation
0.5–12 mm boards35 kg robot configurationThick server PCBs

The production challenge.

Oversized, heavy boards create suction stability, positioning and board-surface protection challenges. A single handling method may not cover the full production range.

A factory-wide custom automation approach for server compute boards, including high-copper-content and fine-line processes.

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ENGINEERING DETAIL / 01

Composite handling for heavier boards

The robot configuration increases payload from 25 kg to 35 kg. Two rows of suction cups work with an integrated vacuum generator, blower and mechanical clamp. Blower assistance starts automatically for boards 5 mm or thicker.

Composite handling for heavier boards

ENGINEERING DETAIL / 02

Transfer directly into the TRAY

For panels that are too large or heavy for stable suction alone, conveying feeds the panel directly into a TRAY. This reduces reliance on suction during the transfer stage.

Transfer directly into the TRAY

ENGINEERING DETAIL / 03

Separate and protect board surfaces

TRAYs keep panels separated when stacked, avoiding panel-to-panel pressure and rubbing. The carrier design supports protection of fine circuit traces during material flow.

Separate and protect board surfaces

ENGINEERING DETAIL / 04

Position sensing at the handling end

An intelligent edge-guiding system detects board position to reduce manual calibration. The integrated vacuum generator and thickness-triggered blower support the selected handling configuration.

Position sensing at the handling end

Inside the application.

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Factory layout for thick server PCB automation

Factory layout for thick server PCB automation

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