PCB Automation / CHENGTAI
Automatic PIN Removal Machine
Combine tape cutting, pin removal and separated material unloading after drilling.
Discuss configuration, installation and project-specific specifications with our engineers.
THE EQUIPMENT AT A GLANCE
Designed for the task.
- Integrated tape cutting and pin removal
- AGV magazine transfer options
- Separate board and auxiliary-material unloading
PROCESS FIT
Where it works.
Post-drilling material separation and PCB handling.
Share your process inputs, production constraints and integration requirements. We will review the appropriate equipment configuration before quotation.
TECHNICAL OVERVIEW
Specifications & configuration.
- Process
- Tape cutting and automatic pin removal
- Operating speed
- 3 stacks/min — confirm configuration and board conditions
- Positioning
- CCD board-orientation detection
- Material handling
- Copper panel, aluminium and backing-board unloading
- Daily output
- Over 3,200 boards, dependent on board configuration and operating schedule
- Installed sales milestone
- 100+ units
Final specifications and acceptance criteria are agreed for your selected configuration.
PROCESS SEQUENCE
One coordinated workflow.
- 01
Stacked-board loading
- 02
Laser glue cutting
- 03
Aluminium sheet unloading
- 04
Backing-board unloading
- 05
Copper-panel unloading
Continue exploring.
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